• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In an adhesive for fixing an electronic component (3) to a printed circuit board (1) and / or for embedding an electronic component (3) in a printed circuit board (1), wherein the determined and / or embedded electronic component (3) via an adhesive bond (2) is fixed to a layer or layer of a particular multilayer printed circuit board (1) and after setting optionally by particular on the outer contours of the embedded component (3) tuned layers coated and / or covered by at least one other layer is provided in that an epoxy resin-based adhesive (2, 11-16) is chosen which has at least one additive, in particular a defoamer and / or an additive for adjusting the leveling properties, for setting the surface tension and / or viscosity, thereby ensuring a secure fixing of a component (3) especially while avoiding voids or air pockets below the surface (6) of the component (3) to be determined can be achieved. In addition, a method and a use are provided.
    公开号:AT13437U1
    申请号:TGM9008/2011U
    申请日:2011-08-02
    公开日:2013-12-15
    发明作者:
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    Austrian Patent Office AT13 437U1 2013-12-15
    Description: The present invention relates to an adhesive for fixing an electronic component to a printed circuit board and / or for embedding an electronic component in a printed circuit board, wherein the electronic component to be defined and / or embedded is bonded to a layer via an adhesive bond a particular multi-layer printed circuit board is set and after setting optionally sheathed by particular tuned to the outer contours of the component to be embedded layers and / or covered by at least one other layer. The present invention further relates to a method for fixing an electronic component to a printed circuit board and / or for embedding an electronic component in a printed circuit board, wherein the determined and / or embedded electronic component via an adhesive bond to a layer or a particular multilayer Printed circuit board is set and after setting optionally sheathed by particular tailored to the outer contours of the component to be embedded layers and / or covered by at least one other layer, using such an adhesive. The present invention further relates to a use of such a method or adhesive.
    In connection with the definition of an electronic component on or on a printed circuit board and / or for embedding an electronic component in a printed circuit board, the problem often occurs that, for example, by a printing process on a layer or layer of a particular multilayer printed circuit board applied adhesive after arranging or placing a component to be defined or embedded below the component to be defined or embedded to form an air-filled cavity, which remains even after a subsequent curing of the adhesive. Such a space filled with air or gas below the example substantially planar surface of the component is due in particular by the shape of the adhesive after application to the layer or substantially similar to a crater or with a corresponding greater height in edge regions of the application surface , As part of a further processing of a printed circuit board provided with such a component at least partially elevated temperatures are used, wherein at such high temperatures of the cavity located under the component and filled with air to tension in the field of attachment of the component to the circuit board or even to a Destruction of the adhesive bond and thus a lifting or loosening of the component or in the worst case can lead to destruction of the component. In addition, it must be ensured, for example, for subsequent contacting steps, that the adhesive layer located between the component and the layer or layer of the printed circuit board is uniform and uniform under the entire surface of the component, in order, for example, to form holes or openings for a contacting, which is usually subsequently filled with a conductive material for proper contact, to allow a defined arrangement of the contact points.
    The present invention therefore aims to provide an adhesive and a method of the type mentioned in that the problems of the above-mentioned prior art are avoided and in particular ensures that while avoiding an air-filled cavity under the festzu laying or embedded component is a uniform arrangement of the adhesive between the layer or position of the circuit board and the surface of festzu to be laid or embedded component.
    To solve the above-mentioned objects, an adhesive of the type mentioned is essentially characterized in that an adhesive is selected based on epoxy resin, which for adjusting the surface tension and / or viscosity at least one additive, in particular a defoamer and / or an additive added to adjust the flow properties, that the adhesive at room temperature has a complex viscosity below 50 Pa.s, in particular between about 20 and 45 Pa.s and that the adhesive is a temperature-induced increase in the complex viscosity with a heating from room temperature to about 50 ° C and within a period of less than 15 minutes, especially about 10 minutes, in particular to at least 1.3 times, in particular about 1.7 to 3 times the complex viscosity at room temperature. By providing an epoxy resin-based adhesive, the adhesive bonding properties between the electronic component and the printed circuit board required for reliable adhesion are provided, and the surface tension and / or viscosity of such epoxy resin-based adhesive required to achieve the convex surface can be achieved by additives. ,
    To achieve and maintain the uniform and uniform adhesive layer between the circuit board and the surface of the component to be embedded or fixed, the invention provides that the adhesive at room temperature, a complex viscosity below 50 Pa.s, in particular between about 20 and 45 Pa.s having. Moreover, in this connection, in order to maintain the properties of the adhesive at elevated temperatures, it is additionally provided according to the invention that the adhesive causes a temperature-induced increase in the complex viscosity when heated from room temperature to about 50 ° C. and within a period of less than 15 minutes, in particular approximately 10 min, in particular to at least 1.3 times, in particular about 1.7 to 3 times the complex viscosity at room temperature.
    To set the required surface tension and / or viscosity is proposed according to a preferred embodiment, that a defoamer, such as a silicone-free defoamer, in an amount of less than 3 wt .-%, in particular about 0.1 to 2.0 wt .-% is added to the adhesive. By adding a defoamer in the specified amount, the desired properties can be achieved with regard to the formation of a convex surface, in particular while maintaining the adhesive properties of the adhesive.
    To set desired flow properties to achieve the convex surface is also proposed that as an additive to improve the flow properties of an acrylate, such as polybutyl acrylate, an acrylate copolymer, such as methacrylate copolymer, an epoxy resin with free hydroxyl, isocyanate and / or ester groups or the like is added, as corresponds to a further preferred embodiment of the adhesive according to the invention. In this context, it is proposed according to a further preferred embodiment that an additive for improving the flow properties in an amount of not more than 7 wt .-%, in particular 0.5 to 5 wt .-% is added.
    In particular, for adaptation to different purposes and / or for adaptation to different subsequent processing or processing steps, it is preferably proposed according to the invention that a plurality of different additives is added to improve the leveling properties.
    It is or is the inventively provided convex surface of the adhesive in particular influenced by the surface tension of the same, it being suggested in this context that the adhesive has a surface tension less than 40 mN / m, in particular between 15 and 35 mN / m , as corresponds to a preferred embodiment of the adhesive.
    Also in support of a reliable formation of a convex surface is preferably proposed that the adhesive has a higher than its elasticity at room temperature viscosity.
    To solve these problems, moreover, a method of the type mentioned above is essentially characterized in that the adhesive used to form the adhesive bond in a conventional manner with a convex surface provided on the support or recording of the electronic component position the printed circuit board is applied, that the component to be defined or embedded is placed on the adhesive and optionally subjected to a compressive stress, and that the adhesive after placing or arranging the component of a 12 Curing treatment is applied, that the adhesive at room temperature has a complex viscosity below 50 Pa.s, in particular between about 20 and 45 Pa.s and that the adhesive is a temperature-induced increase in the complex viscosity with a warming from room temperature to about 50 ° C and within a period of less than 15 minutes, in particular about 10 minutes, in particular to at least 1.3 times, in particular about 1.7 to 3 times the complex viscosity at room temperature.
    Characterized in that the invention proposes to apply the adhesive which is used or used to form the adhesive bond, with a convex surface on the layer or position of the circuit board and subsequently to arrange the component to be fixed or embedded on the adhesive, is ensures that a formation of an air-filled cavity below the component to be defined or embedded is avoided, as can be safely avoided by the convex curvature or shaping of the adhesive in an arrangement of the component on the applied adhesive surface cavities. By providing the convex surface of the adhesive and thus a substantially maximum thickness of the adhesive used for forming the adhesive bond in a substantially central region thus a uniform and homogeneous distribution of the adhesive between the used for support layer or position of the circuit board and the surface of the component to be determined, since in particular in the case of a substantially parallel approach of the corresponding surface of the component to be fixed or embedded to the adhesive surface arranged on the layer or layer of the printed circuit board starting from the substantially central region, which forms the highest elevation of the adhesive surface by forming the adhesive surface Has a convex surface, in a further approximation of the component to the layer or position a complete escape of air in each case or in the edge regions of the component to be determined occurs. After the arrangement of the component on the layer or layer mediated by the convex adhesive surface and thus avoiding cavities below the component to be defined or einzubettenden a curing treatment in which durable uniform and uniform arrangement of the adhesive while avoiding voids or trapped air safely maintained becomes.
    In this context, moreover, the invention provides that the adhesive at room temperature has a complex viscosity below 50 Pa.s, in particular between about 20 and 45 Pa.s. By adhering to this inventively proposed parameter for the viscosity of the adhesive at room temperature, the desired for a proper determination avoiding voids convex surface of the adhesive can be reliably obtained. The complex viscosity is the frequency-dependent viscosity function which is obtained during a forced harmonic oscillation of a shear stress.
    As already stated above, a printed circuit board and its components during further processing steps are usually exposed to high temperatures and optionally high pressures. In order to provide a secure adhesion and the uniform and uniform provision of an adhesive layer below the component while avoiding cavities even when compared to the arrangement of the component by switching the adhesive layer, in particular at room temperature changed environmental conditions, according to the invention additionally provided that the adhesive is a temperature-related Increasing the complex viscosity when heated from room temperature to about 50 ° C and within a period of less than 15 minutes, in particular about 10 minutes, in particular to at least 1.3 times, in particular about 1.7 to 3 times the complex viscosity at room temperature. In this way, the secure adhesion of the component to the printed circuit board is also made possible during subsequent processing or processing steps.
    In order to prevent the adhesive from emerging beyond the contours of the component to be defined or embedded, the convex surface of the adhesive is thus provided, and thus during the arrangement of the adhesive during the dispensing thereof, proceeding from an essentially three-dimensional Austrian Patent Office AT13 437U1 2013- 12-15 central portion, which has a maximum thickness of the adhesive, to avoid in the direction of edge or edge regions, it is proposed according to a preferred embodiment, that the adhesive in a relation to the outer contours of the component to be determined or einzubettenden reduced dimension on the position is applied for supporting or receiving the component. By providing a reduced dimension of the arranged on the layer or layer of the printed circuit board adhesive is thus due to the distribution of the adhesive applied with a convex surface during the approach of the component to the layer or layer mediated by the adhesive bond, a uniform and uniform adhesive surface between the layer or position of the circuit board and the component ensured. At the same time a particularly excessive leakage of the adhesive over edge areas or outer contours of the component to be defined or embedded is avoided.
    To achieve the desired uniform distribution of the adhesive in compliance with the convex surface of the same before the arrangement of the component to be defined or embedded is also proposed that the adhesive in areas corresponding to edge regions of the outer contour of festzu laying or embedded component with a lower thickness or Thickness and / or applied in a smaller amount, as corresponds to a further preferred embodiment of the method according to the invention.
    In order to prevent excessive accumulation of adhesive in sub-areas and to ensure a uniform distribution of the adhesive over the entire surface of the component to be defined or embedded in particular for large-area components, it is proposed according to a further preferred embodiment that the adhesive only in partial areas corresponding to the outer contour the component to be defined or embedded is applied to the position for supporting the component, wherein the adhesive is applied in all, optionally separated, portions with a convex surface. In this way, a uniform and uniform distribution of the adhesive between the surface of the component to be defined or embedded and the corresponding layer or position of the printed circuit board can be obtained in particular in adaptation to the dimensions of the component after the component has been arranged on the convex adhesive surface.
    To further support the uniform and uniform distribution of the adhesive and in addition to avoiding an exit of the adhesive over the edge regions or the outer contours of the component to be embedded or to be determined addition, it is proposed that the adhesive in a substantially rectangular or rectangular component with a cushion or pillow-like extension is applied, as corresponds to a further preferred embodiment of the method according to the invention. With such a cushion-like extension to provide a convex surface and in adaptation to a substantially rectangular or rectangular component can be provided after an arrangement of the component, a uniform and uniform distribution while avoiding all air pockets and cavities.
    For reliable achievement of the convex surface is proposed according to a further preferred embodiment that the surface tension of the adhesive is less than 40 mN / m, in particular between 15 and 35 mN / m is selected. By appropriate choice or adjustment of the surface tension of the adhesive, the inventively proposed convex surface is provided at a orders of the same on the supporting layer or position of the circuit board for avoiding air inclusions in a determination of the component.
    In order to support a taking or providing a convex surface of the adhesive in an application of the same is proposed according to a further preferred embodiment, that an adhesive is selected with a room temperature compared to its elasticity higher viscosity.
    For a particularly simple and reliable application of the adhesive with the inventions according to the proposed convex surface is also proposed that the adhesive in a conventional manner by a printing process, in particular Siebdruckver- 413 Austrian Patent Office AT13 437U1 2013-12 Driving is applied, as corresponds to a further preferred embodiment of the method according to the invention.
    To achieve the above-mentioned objects, the use of a method according to the present invention or a preferred embodiment as well as an adhesive according to the invention or a preferred embodiment for fixing an electronic component to or on a circuit board and / or according to the invention proposed for embedding an electronic component in a circuit board.
    The invention is described below with reference to embodiments schematically illustrated in the accompanying drawings and examples of compositions of the adhesive according to the invention. In the drawings: FIG. 1 shows a schematic partial view of a printed circuit board on which a component is determined using the method according to the invention and an adhesive according to the invention; FIG. Fig. 2 is an idealized schematic representation of the arrangement of a erfindungsge MAESSEN glue with a convex surface in the context of the method according to the invention; 3 shows a likewise idealized illustration of an essentially pillow-shaped arrangement of an adhesive according to the invention in the context of the method according to the invention for fixing a particular rectangular component; and [0027] FIG. 4 shows a plurality of schematic representations or plan views similar to FIG. 3 of different embodiments of an application or arrangement of an adhesive according to the invention in the context of the method according to the invention.
    In Fig. 1 is schematically denoted by 1, for example, a multilayer printed circuit board, on which, by means of an adhesive layer 2, a schematically indicated with 3 electronic component is set. As indicated schematically in Fig. 1, the adhesive 2, which is used to form the adhesive bond, on a convex surface 4, which is directed to the component 3 and in particular to a provided, for example, with contacts 5 surface 6.
    For a determination of the component 3 in the direction of the arrow 7 to the circuit board 1, on which the adhesive 2 was applied for example by a printing process, in particular a screen printing method, approximated, in particular by the convex surface 4, which in the middle Area of the adhesive 2 has the greatest thickness or extent, a full-surface concerns the surface 4 of the adhesive to the surface 6 of the component 3 to be determined is achieved.
    After an arrangement of the component 3 or embedding in the adhesive 2, for example, a hardening of the adhesive takes place. 2
    By providing the convex surface 4 of the adhesive 2, the formation of voids or air bubbles below the surface 6 of the component 3 to be determined is avoided, so that in particular in subsequent loading or processing steps of such a circuit board, a loosening or lifting the Component 3 by an expansion of the enclosed gas in a cavity and, where appropriate, a destruction of the component 3 need not be feared.
    Instead of the fixing of the component 3, shown schematically in FIG. 1, on a surface of the printed circuit board 1, an embedding of a component 3 in a corresponding cavity or a recess of a, in particular, multilayer printed circuit board can also be undertaken directly. As an alternative to embedding in a cavity, following a fixation of the component 3 on the printed circuit board 1, by means of the adhesive layer 2, a jacket of the component 3 for embedding it can be made. 5/12
    Austrian Patent Office AT13 437U1 2013-12-15 FIG. 2 indicates an idealized representation of the convex surface 4 of an adhesive layer, again denoted by 2.
    The geometric relationships in such an idealized case are as follows:
    r-b s- (r-h) 2 2 In an idealized application of a length X or width Y, the circular chord s corresponds to a substantially rectangular component whose contours are again designated 3 in FIG.
    Taking into account the formulas given for the formation of the convex surface 4 and a provision of a substantially pillow-like arrangement of the adhesive 2 on the non-illustrated layer or position of the circuit board is arranged after arranging the component 3, as shown in FIG. 1, a uniform and uniform distribution of the adhesive 2 between the supporting layer or position of the printed circuit board and the facing surface of the component 3 is achieved. Taking into account the different dimensions X and Y, different parameters r ^ r2, h ^ h2 result in the above formulas.
    From Fig. 3 it can be seen that, through the pillow-like training taking into account the dimensions listed above and to form a convex surface, as indicated in Fig. 1 and 2, over the entire surface of the length X or Wide Y limited component 3 secure adhesion can be achieved.
    In addition, by the pillow-like formation, in which in edge regions substantially in central portions along the sides, which are denoted by X and Y, an adhesive 2 is not provided up to the edge regions, and a through the convex surface conditional distribution in an arrangement of the component 3 on the adhesive surface 2 ensures that leakage of the adhesive 2 on the outer contours of the component 3 does not occur. It is thus avoided that, for example, in further processing steps over the outer contours of the component 3 protruding remnants of the adhesive must be removed before further processing steps.
    In Fig. 4 further modified ways of applying an adhesive are each schematically indicated for a substantially square component.
    Thus, in the embodiments according to FIGS. 4a and 4b, essentially star-shaped adhesive arrangements are provided which are provided with a multiplicity of partial regions 11 and 12, wherein free surfaces remain between the individual partial regions 11 and 12. The individual subregions 11 and 12 each have in turn a convex surface, so that a uniform distribution of the adhesive is achieved when an unspecified component is applied.
    In Fig. 4c, a modified embodiment is shown, wherein a plurality of substantially rectangular individual adhesive surfaces 13 adjacent to each other according to a matrix taking into account the outer dimensions of the component, not shown, is provided. The individual subregions 13 each have in turn a convex surface, so that when the adhesive is arranged by the free surfaces provided between the subregions 13, a uniform distribution while avoiding a development of fertilizer is achieved. US Pat Cavities or air bubbles can be achieved.
    The same applies to the embodiment shown in Fig. 4d, wherein a substantially central region 14, which in turn has a convex surface of the adhesive, and in corner regions additionally substantially circular portions 15 are provided.
    In the embodiment shown in Fig. 4e small partial areas 16 are provided substantially along side edges or side edges, which in turn each have a convex curvature and allow a desired definition with a uniform thickness in each case in edge regions of a component not shown in detail.
    To obtain the desired convex surface of the adhesive 2 or of subareas 11, 12, 13, 14, 15, 16 thereof, as shown in particular schematically in FIG. 4, in the following Table I physical data for different Embodiments of adhesives given, wherein a comparative example is given, but which does not allow the formation of a convex surface.
    Table I
    Surface tension [mN / m] Complex viscosity 20 ° C [Pa.s] Complex viscosity 50 O, 10 min [Pa.sl Ex. 1 30, 9 22 45 Ex. 2 31,6 33 43 Ex. 3 31,0 43 84 Example 4 32.3 23 67 Comp. Ex. 45.4 57 24 It can be seen from the above Table I that the adhesives according to Examples 1 to 4 which provide a convex surface each have a surface tension in the range of about 30 mN / m, while the Surface tension according to the comparative example is about 45 mN / m.
    Furthermore, it can be seen that the complex viscosity at 20 ° C for Examples 1 to 4 is below 50 Pa.s and in particular between 20 and 45 Pa.s, while the corresponding value for the comparative example is above a limit of 50 Pa.s is lying.
    In addition, it can be seen that the complex viscosity increases when heated to 50 ° C and within a period of 10 minutes for the convex surface forming Examples 1 to 4 and in particular at least 1.3 times, preferably the 1 , 7 to 3 times the complex viscosity at room temperature (20 ° C), while for the comparative example, the complex viscosity decreases to less than half of it at room temperature.
    The complex viscosity for the examples given in Table I and the comparative example was determined for both temperatures at the same, standardized amplitude of the oscillation and the same angular frequency of, for example, 6 (1 / s).
    In the following Table II compositions are also given for a plurality of adhesive formulations, which in turn provide a convex surface of the adhesive after application to a layer or a printed circuit board, while for Comparative Examples does not achieve the formation of a convex surface could be.
    The adhesive formulations are each based on one-component epoxy resin adhesive having a viscosity of about 20 Pa.s, which is changed accordingly by adding the specified additives.
    As a defoamer, a silicone-free defoamer, for example BYK-054 is used in the table below. To improve the flow properties, for example, a polyacrylate, for example BYK-S706 or BYK-359 is used.
    The following data relate in each case to wt .-%.
    TABLE II Solvent% Leveling Agent% Defoamer% Ex. 1 - 2 0, 5 Ex. 2 - 2 1 Ex. 3 - 3 1 Ex. 4 - 4 1 Ex. 5 0, 3 4 1 Comp. Ex. 1 0.5 - 0.7 Comp. Ex. 2 0, 5 - 0.7 It can be seen from Table II above that a convex surface is formed in particular by the addition of a leveling agent and with small amounts of a defoamer.
    Hiebei are the compositions specified under Example 1 and 2 with a relatively small amount of leveling agent and defoamer, especially for small adhesive surfaces of, for example, less than 2 x 2 mm.
    By increasing the proportion of leveling agent in particular a convex surface is achieved with larger adhesive surfaces. Hiebei has a composition according to Example 3 with adhesive surfaces to about 6x6 mm proved to be suitable, while according to Example 4 and 5 convex surfaces can be achieved up to a dimension of about 10x10 mm.
    In addition, the compositions according to Example 4 and 5 show very good flow properties. Furthermore, defoaming in containers in Example 5 can be achieved by additionally providing a solvent.
    In contrast, in the comparative examples, although a defoaming effect could be obtained, but in particular by the absence of a leveling agent and thus the possibility of adjusting the surface tension, as indicated in Table I, to a value to be set of less than 40 mN / m and in particular less than 35 mN / m, the formation of a convex surface of the adhesive could not be achieved by a printing process, in particular a screen printing process. 8/12
    权利要求:
    Claims (16)
    [1]
    Austrian Patent Office AT13 437U1 2013-12-15 Claims 1. Adhesive for fixing an electronic component (3) to a printed circuit board (1) and / or for embedding an electronic component (3) in a printed circuit board (1), whereby the or embedded electronic component (3) via an adhesive bond (2) on a layer or layer of a particular multilayer printed circuit board (1) is determined and after setting optionally by particular to the outer contours of the embedded component (3) tuned layers encased and / or is covered by at least one further layer, characterized in that an adhesive (2, 11-16) is selected based on epoxy resin, which for adjusting the surface tension and / or viscosity at least one additive, in particular a defoamer and / or an additive for adjusting the Has added flow properties that the adhesive (2, 11-16) at room temperature, a complex Visko and that the adhesive (2, 11-16) exhibits a temperature-induced increase in the complex viscosity when heated from room temperature to about 50 ° C and within a period of less than 50 Pa.s than 15 minutes, especially about 10 minutes, in particular to at least 1.3 times, in particular about 1.7 to 3 times the complex viscosity at room temperature.
    [2]
    2. Adhesive according to claim 1, characterized in that a defoamer, for example a silicone-free defoamer, in an amount of less than 3 wt .-%, in particular about 0.1 to 2.0 wt .-% is added to the adhesive.
    [3]
    3. Adhesive according to claim 1 or 2, characterized in that as an additive for improving the flow properties of an acrylate, such as polybutyl acrylate, an acrylate copolymer, for example methacrylate copolymer, an epoxy resin with free hydroxyl, isocyanate and / or ester groups or the like is added.
    [4]
    4. An adhesive according to claim 3, characterized in that an additive for improving the leveling properties in an amount of not more than 7 wt .-%, in particular 0.5 to 5 wt .-% is added.
    [5]
    5. Adhesive according to claim 3 or 4, characterized in that a plurality of different additives is added to improve the leveling properties.
    [6]
    6. Adhesive according to one of claims 1 to 5, characterized in that the adhesive (2, 11-16) has a surface tension of less than 40 mN / m, in particular between 15 and 35 mN / m.
    [7]
    7. Adhesive according to one of claims 1 to 6, characterized in that the adhesive (2, 11-16) at room temperature has a relation to its elasticity higher viscosity.
    [8]
    8. A method for fixing an electronic component (3) to a printed circuit board (1) and / or for embedding an electronic component (3) in a printed circuit board (1), wherein the determined and / or embedded electronic component (3) via an adhesive bond (2) is fixed to a layer or a layer of a particularly multi-layer printed circuit board (1) and, optionally, encased by layers adapted in particular to the outer contours of the component (3) to be embedded and / or covered by at least one further layer An adhesive according to any one of claims 1 to 7, characterized in that the adhesive used to form the adhesive bond (2, 11-16) in a conventional manner with a convex surface (4) on the support or receiving the electronic component (3) provided position of the printed circuit board (1) is applied, that to be determined or einzubettende component (3) on the adhesive (2, 11-16 ) and optionally subjected to compressive stress such that the adhesive (2, 11-16) is subjected to a hardening treatment after the component (3) has been placed, that the adhesive (2, 11-16) becomes a complex one at room temperature Viscosity below 50 Pa.s, in particular between about 20 and 45 Pa.s and that the adhesive (2, 11-16) a temperature-induced increase in the complex viscosity with a warming from room temperature to 9/12 Austrian Patent Office AT13 437U1 2013-12 -15 to about 50 ° C and within a period of less than 15 minutes, in particular about 10 minutes, in particular to at least 1.3 times, in particular about 1.7 to 3 times the complex viscosity at room temperature.
    [9]
    9. The method according to claim 8, characterized in that the adhesive (2, 11-16) in a relation to the outer contours of the component to be defined or embedded component (3) reduced dimension on the position for supporting or receiving the component (3) is applied ,
    [10]
    10. The method according to claim 8 or 9, characterized in that the adhesive (2, 11-16) applied in areas corresponding to edge regions of the outer contour of the component to be defined or embedded (3) with a lower thickness or thickness and / or in a smaller amount becomes.
    [11]
    11. The method according to claim 8, 9 or 10, characterized in that the adhesive (2, 11-16) is applied only in partial areas corresponding to the outer contour of the component to be defined or embedded (3) on the position for supporting the component (3) in which the adhesive is applied in all, optionally separated, portions with a convex surface.
    [12]
    12. The method according to any one of claims 8 to 11, characterized in that the adhesive (2) is applied at a substantially rectangular or rectangular component (3) with a pols-ter- or pillow-like extension (Fig. 3).
    [13]
    13. The method according to any one of claims 8 to 12, characterized in that the surface tension of the adhesive (2, 11-16) is less than 40 mN / m, in particular between 15 and 35 mN / m is selected.
    [14]
    14. The method according to any one of claims 8 to 13, characterized in that an adhesive (2, 11-16) is selected with a higher viscosity at room temperature compared to its elasticity.
    [15]
    15. The method according to any one of claims 8 to 14, characterized in that the adhesive (2, 11-16) is applied in a conventional manner by a printing process, in particular screen printing process.
    [16]
    16. Use of a method according to any one of claims 8 to 15 and an adhesive according to one of claims 1 to 7 for fixing an electronic component to a printed circuit board and / or for embedding an electronic component in a printed circuit board. For this 2 sheets drawings 10/12
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    US20130126091A1|2013-05-23|
    DE112011102580A5|2013-05-29|
    EP2416633A1|2012-02-08|
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    法律状态:
    2020-04-15| MM01| Lapse because of not paying annual fees|Effective date: 20190831 |
    优先权:
    申请号 | 申请日 | 专利标题
    EP10450127A|EP2416633A1|2010-08-04|2010-08-04|Method for fixing and/or embedding an electronic component and adhesive for use in such a method|
    PCT/AT2011/000321|WO2012016258A2|2010-08-04|2011-08-02|Adhesive for fixing and/or embedding an electronic component and metnod and use|
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